Image sensor with shallow trench edge doping

ABSTRACT

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a photodetector region arranged within a semiconductor substrate. One or more dielectric materials are disposed within a trench defined by one or more interior surfaces of the semiconductor substrate. A doped epitaxial material is arranged within the trench and is laterally between the one or more dielectric materials and the photodetector region. A dielectric protection layer is arranged over the one or more dielectric materials within the trench. The dielectric protection layer laterally contacts a sidewall of the doped epitaxial material.

REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation of U.S. application Ser. No.16/578,355, filed on Sep. 22, 2019, which is a Divisional of U.S.application Ser. No. 15/935,437, filed on Mar. 26, 2018, which claimsthe benefit of U.S. Provisional Application No. 62/579,488, filed onOct. 31, 2017. The contents of the above-referenced Patent Applicationsare hereby incorporated by reference in their entirety.

BACKGROUND

Integrated circuits (ICs) with image sensors are used in a wide range ofmodern day electronic devices, such as, for example, cell phones andmedical imaging equipment. In recent years, complementary metal-oxidesemiconductor (CMOS) image sensors have begun to see widespread use,largely replacing charge-coupled device (CCD) image sensors. Compared toCCD image sensors, CMOS image sensors are favored due to low powerconsumption, small size, fast data processing, a direct output of data,and low manufacturing cost. Some types of CMOS image sensors includefront-side illuminated (FSI) image sensors and back-side illuminated(BSI) image sensors.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of anintegrated image sensor having one or more dielectric materials and adoped epitaxial material arranged within a trench in a substrate.

FIG. 2 illustrates a cross-sectional view of some additional embodimentsof an integrated image sensor having one or more dielectric materialsand a doped epitaxial material arranged within a trench in a substrate.

FIG. 3 illustrates a cross-sectional view of some alternativeembodiments of an integrated image sensor having one or more dielectricmaterials and a doped epitaxial material arranged within a trench in asubstrate.

FIGS. 4A-4B illustrate some additional embodiments of an integratedimage sensor having one or more dielectric materials and a dopedepitaxial material arranged within a trench in a substrate.

FIG. 5 illustrates a cross-sectional view of some additional alternativeembodiments of an integrated image sensor having one or more dielectricmaterials and a doped epitaxial material arranged within a trench in asubstrate.

FIGS. 6-15 illustrate cross-sectional views of some embodiments of amethod of forming an integrated image sensor having one or moredielectric materials and a doped epitaxial material arranged within atrench in a substrate.

FIG. 16 illustrates a flow diagram of some embodiments of a method offorming an integrated image sensor having one or more dielectricmaterials and a doped epitaxial material arranged within a trench in asubstrate.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

An integrated image sensor typically contains large arrays of pixelregions respectively comprising a photodetector disposed within thesemiconductor substrate. The pixel regions are electrically isolatedfrom one another by isolation structures (e.g., shallow trench isolationstructures) disposed within trenches in the semiconductor substrate.During fabrication of the isolation structures, the semiconductorstructure is etched to form a trench, which is subsequently filled withone or more dielectric materials. The etching processes used to form thetrench can damage the semiconductor substrate, resulting in defects(e.g., dangling bonds, etc.) along interior surfaces of thesemiconductor substrate defining the trench. The defects may trap chargecarriers (e.g., electrons) and cause an unwanted leakage current to flowbetween adjacent pixel regions, leading to dark current and white pixelissues within the integrated image sensor.

To prevent the unwanted leakage current between adjacent pixel regions,an implantation process may be performed to form a well region alongedges of the trench. The well region is selected to have a doping typethat prevents the movement of charge carriers towards the trench,thereby mitigating the leakage current. However, such an implantationprocess is also used to concurrently form an additional well regionextending under a channel region of a transfer transistor within thepixel region (e.g., to tune a threshold voltage of the transfertransistor). If the implantation process is performed with a high dopingconcentration, the unwanted leakage current can be mitigated, but animage lag of the transfer transistor is increased. Alternatively, if theimplantation process is performed with a low doping concentration, theimage lag of the transfer transistor can be improved but the unwantedleakage current is worse.

The present disclosure, in some embodiments, relates to an integratedimage sensor configured to provide for both low image lag and leakagecurrents. The integrated image sensor comprises a photodetector arrangedwithin a semiconductor substrate and separated from a trench within thesubstrate by a first well region. An isolation structure comprising oneor more dielectric materials is disposed within the trench. A dopedepitaxial material is also arranged within the trench at a locationlaterally between the one or more dielectric materials and the firstwell region. The doped epitaxial material has a first dopingconcentration that is configured to increase a doping concentration ofthe first well region. By increasing a doping concentration of the firstwell region isolation between the photodetector and the trench isincreased and unwanted leakage currents between adjacent pixel regionsare reduced. Furthermore, a second well region under a transfertransistor can be selected to have a second doping concentration that isless than the first doping concentration so as to mitigate image lag.

FIG. 1 illustrates a cross-sectional view of some embodiments of anintegrated image sensor 100 having one or more dielectric materials anda doped epitaxial material arranged within a trench in a substrate.

The integrated image sensor 100 comprises a photodetector 104 disposedwithin a substrate 102. In some embodiments, the photodetector 104 maycomprise a photodiode (e.g., a pinned photodiode). In such embodiments,the photodetector 104 has a first doped region having a first dopingtype (e.g., an n-type doping) and an overlying second doped regionhaving a second doping type (e.g., a p-type doping). In someembodiments, the first and second doped regions may both be disposedwithin the substrate 102. In other embodiments, the first doped regionmay be disposed within the substrate 102 and the second doped region maycomprise an epitaxial layer overlying the substrate 102. In someembodiments, the integrated image sensor 100 may comprise a front-sideilluminated (FSI) image sensor, which is configured to receive incidentradiation along a first surface 102 a (i.e., a front-side) of thesubstrate 102 prior to the radiation reaching a second surface 102 b(i.e., a back-side) of the substrate 102. In other embodiments, theintegrated image sensor 100 may comprise a back-side illuminated (BSI)image sensor, which is configured to receive incident radiation alongthe second 102 b prior to the radiation reaching the first surface 102a.

A gate structure 108 is disposed over the substrate 102 at a locationbetween the photodetector 104 and a floating diffusion region 106 withinthe substrate 102. The gate structure 108 comprises a conductive gatematerial 112 separated from the substrate 102 by a gate dielectric layer110. In some embodiments, the conductive gate material 112 may beflanked by sidewall spacers 118. The floating diffusion region 106comprises a doped region having the first doping type (e.g., the n-typedoping). A conductive contact 114 is arranged over the gate structure108. The conductive contact 114 is surrounded by a dielectric structure116 (e.g., an inter-level dielectric (ILD) layer) over the substrate102.

The substrate 102 comprises interior surfaces (e.g., sidewalls and alower surface) defining a trench 120 disposed within the first surface102 a of the substrate 102. In some embodiments, the trench 120 may bearranged within a first well region 124 a within the substrate 102 andthe floating diffusion region 106 may be arranged within a second wellregion 124 b within the substrate 102. The first well region 124 a andthe second well region 124 b have the second doping type (e.g., thep-type doping). In some embodiments, a second well region 124 b mayextend from around the floating diffusion region 106 to below the gatestructure 108. By having the second well region 124 b extend to belowthe gate structure 108, the second well region 124 b can be used to tunea threshold voltage of the gate structure 108.

One or more dielectric materials 122 are disposed within the trench 120.In various embodiments, the one or more dielectric materials 122 maycomprise an oxide, a nitride, or the like. A doped material having thesecond doping type (e.g., a p-type doping) is also disposed within thetrench 120. In some embodiments, the doped material may comprise a dopedepitaxial material 126 disposed within the trench 120, while in otherembodiments the doped material may be formed by non-epitaxial methods.The doped epitaxial material 126 is arranged along sidewalls of thesubstrate 102 that define the trench 120. In some embodiments, a firstside of the doped epitaxial material 126 laterally contacts a sidewallof the substrate 102 and a second side of the doped epitaxial material126 laterally contacts the one or more dielectric materials 122 withinthe trench 120. In some embodiments, the doped epitaxial material 126protrudes outward from the trench 120 to over the substrate 102.

The doped epitaxial material 126 has a larger doping concentration thanthat of the first well region 124 a and/or the second well region 124 b.For example, in some embodiments, the first well region 124 a and thesecond well region 124 b may have a doping concentration that is in arange of between approximately 1×10¹⁵ atoms/cm³ and approximately 1×10¹⁷atoms/cm³, while the doped epitaxial material 126 may have a dopingconcentration that is greater than approximately 1×17 atoms/cm³. Thehigher doping concentration of the doped epitaxial material 126 causesthe first well region 124 a to have a doping concentration that ishigher between the trench 120 and photodetector 104 than a dopingconcentration of the second well region 124 b below the gate structure108. This is because the higher doping concentration of the dopedepitaxial material 126 causes dopants from the doped epitaxial material126 to diffuse into the surrounding regions of the first well region 124a, thereby increasing a doping concentration of first well region 124 anear the trench 120 without increasing a doping concentration of thesecond well region 124 b below the gate structure 108.

The higher doping concentration of the first well region 124 a near thetrench 120 reduces leakage currents between adjacent pixel regions byincreasing isolation between the photodetector 104 and the trench 120and/or by neutralizing charge carriers (e.g., electrons) trapped bydefects formed along the interior surfaces of the trench 120 duringetching of the substrate 102. The lower doping concentration of thesecond well region 124 b below the gate structure 108 decreases athreshold voltage and an associated image lag of the gate structure 108.Therefore, the doped epitaxial material 126 is able to improveperformance of the integrated image sensor 100 by mitigating leakagecurrents while improving an image lag of the gate structure 108.

FIG. 2 illustrates a cross-sectional view of some additional embodimentsof an integrated image sensor 200 having one or more dielectricmaterials and a doped epitaxial material arranged within a trench in asubstrate.

The integrated image sensor 200 comprises a photodetector 104 disposedwithin a substrate 102. In some embodiments, the photodetector 104comprises a photodiode having a first photodiode region 202 and anoverlying second photodiode region 204. The first photodiode region 202is a doped region disposed within the substrate 102 and having anuppermost surface that is arranged along an upper surface of thesubstrate 102 (e.g., that is substantially co-planar with the uppersurface of the substrate 102). The second photodiode region 204 iscomprised within a doped epitaxial material 126 arranged over the uppersurface of the substrate 102.

The photodetector 104 is laterally separated from a floating diffusionregion 106 arranged within the substrate 102. In some embodiments, thefirst photodiode region 202 may have a first doping type (e.g., ann-type doping), the second photodiode region 204 may have a seconddoping type (e.g., a p-type doping) different than the first dopingtype, the substrate 102 may have the first doping type (e.g., the n-typedoping), and the floating diffusion region 106 may have the first dopingtype (e.g., the n-type doping). In some embodiments, the photodetector104 abuts a first well region 124 a having the second doping type (e.g.,the p-type doping) and the floating diffusion region 106 is surroundedby a second well region 124 b having the second doping type (e.g., thep-type doping). The second well region 124 b may continuously extendfrom around the floating diffusion region 106 to below the gatestructure 108.

A gate structure 108 is disposed over the substrate 102 at a locationbetween the photodetector 104 and the floating diffusion region 106. Thegate structure 108 comprises a conductive gate material 112 separatedfrom the substrate 102 by a gate dielectric layer 110. A dielectricprotection layer 206 extends along opposing sides of the conductive gatematerial 112 and over the substrate 102. In some embodiments, sidewallspacers 118 are arranged over the dielectric protection layer 206 alongthe opposing sides of the conductive gate material 112.

In some embodiments, the conductive gate material 112 comprisespolysilicon. In such embodiments, the gate dielectric layer 110 mayinclude a dielectric material, such as an oxide (e.g., silicon dioxide),a nitride (e.g., silicon-nitride), or the like. In other embodiments,the conductive gate material 112 may comprise a metal, such as aluminum,copper, titanium, tantalum, tungsten, molybdenum, cobalt, or the like.In such embodiments, the gate dielectric layer 110 may comprise a high-kdielectric material, such as hafnium oxide, hafnium silicon oxide,hafnium tantalum oxide, aluminum oxide, zirconium oxide, or the like. Insome embodiments, the dielectric protection layer 206 may comprise anoxide (e.g., silicon dioxide), a nitride (e.g., silicon-nitride), or thelike. In some embodiments, the sidewall spacers 118 may comprise anoxide, a nitride, a carbide, or the like.

The substrate 102 has interior surfaces that define a trench 120arranged within the first well region 124 a. One or more dielectricmaterials 122 (e.g., an oxide, a nitride, or the like) are disposedwithin the trench 120. The doped epitaxial material 126 is also disposedwithin the trench 120. The doped epitaxial material 126 has the seconddoping type (e.g., the p-type doping) with a higher doping concentrationthan that of the first well region 124 a. In some embodiments, the dopedepitaxial material 126 may comprise a semiconductor material, such assilicon (e.g., monocrystalline silicon or polysilicon), germanium,indium, or the like.

A first sidewall of the doped epitaxial material 126 laterally contactsthe one or more dielectric materials 122 within the trench 120 and asecond sidewall of the doped epitaxial material 126 laterally contacts afirst sidewall 120 a of the substrate 102 defining the trench 120. Insome embodiments, the doped epitaxial material 126 is separated from asecond sidewall 120 b of the substrate 102 by the one or more dielectricmaterials 122. By lining the first sidewall 120 a of the substrate 102with the doped epitaxial material 126, a doping concentration of thefirst well region 124 a can be increased near the trench 120, therebyincreasing electrical isolation between the photodetector 104 and thetrench 120 and reducing a leakage current between the photodetector 104and an adjacent pixel region. In some embodiments, the first well region124 a may have a gradient doping concentration that increases (e.g.,monotonically increases) from the first photodiode region 202 to thefirst sidewall 120 a of the substrate 120 defining the trench 120.Furthermore, by separating the doped epitaxial material 126 from thesecond sidewall 120 b, the one or more dielectric materials 122 are alsoable to provide electrical isolation between the photodetector 104 andthe adjacent pixel region.

In some embodiments, the doped epitaxial material 126 continuouslyextends from within the trench 120 to above the first photodiode region202. In other embodiments (not shown), the doped epitaxial material 126within the trench 120 may be discontinuous from the doped epitaxialmaterial 126 over the first photodiode region 202. In some embodiments,the dielectric protection layer 206 may have a sidewall that laterallycontacts a sidewall of the doped epitaxial material 126. In someembodiments, the sidewall of the doped epitaxial material 126 mayfurther contact the sidewall spacers 118.

During operation, electromagnetic radiation 210 (e.g., photons) strikingthe photodetector 104 generates charge carriers 208, which are collectedin the first photodiode region 202. When the gate structure 108 (whichis configured to operate as a transfer transistor) is turned on, thecharge carriers 208 in the first photodiode region 202 are transferredto the floating diffusion region 106 as a result of a potentialdifference existing between the photodetector 104 and floating diffusionregion 106. The charges are converted to voltage signals by asource-follower transistor 214. A row select transistor 216 is used foraddressing. Prior to charge transfer, the floating diffusion region 106is set to a predetermined low charge state by turning on a resettransistor 212, which causes electrons in the floating diffusion region106 to flow into a voltage source (V_(DD)). Although the pixel region ofFIG. 2 is described as having a transfer transistor disposed within thesubstrate 102 it will be appreciated that reset transistor 212, thesource-follower transistor 214, and the row select transistor 216 mayalso be arranged within the substrate 102 (e.g., as shown in FIG. 5).

FIG. 3 illustrates a cross-sectional view of some alternativeembodiments of an integrated image sensor 300 having one or moredielectric materials and a doped epitaxial material arranged within atrench in a substrate.

The integrated image sensor 300 comprises a photodetector 104 disposedwithin a substrate 102 at a location laterally separated from a floatingdiffusion region 106 disposed within the substrate 102. Thephotodetector 104 comprises a photodiode having a first doped region 302and a second doped region 304 both disposed within the substrate 102. Insome embodiments, the first doped region 302 may have a first dopingtype (e.g., an n-type doping), the second doped region 304 may have asecond doping type (e.g., a p-type doping) different than the firstdoping type, the substrate 102 may have the first doping type (e.g., then-type doping), and the floating diffusion region 106 may have the firstdoping type (e.g., the n-type doping).

One or more dielectric materials 122 (e.g., an oxide, a nitride, or thelike) are disposed within a trench 120 in the substrate 102. In someembodiments, the trench 120 may be arranged within a first well region124 a having the second doping type (e.g., the p-type doping). A dopedepitaxial material 126 having the second doping type (e.g., the p-typedoping) is disposed within the trench 120. In some embodiments, theupper surface of the doped epitaxial material 126 may comprise a divot308 arranged over the trench 120.

In some embodiments, the doped epitaxial material 126 may have abottommost surface that is separated from a bottom of the trench 120 bya non-zero distance 306. In such embodiments, the doped epitaxialmaterial 126 may be laterally and vertically separated from thesubstrate 102 by the one or more dielectric materials 122 (e.g., thedoped epitaxial material 126 may be separated from the substrate 102 bythe one or more dielectric materials 122 along a first direction andalong a second direction that is perpendicular to the first direction).

FIG. 4A illustrates a cross-sectional view of some additionalembodiments of an integrated image sensor 400 having one or moredielectric materials and a doped epitaxial material arranged within atrench in a substrate.

The integrated image sensor 400 comprises a pixel region 401 having afirst gate structure 108 and a second gate structure 402 arranged over asubstrate 102. The first gate structure 108 is associated with atransfer transistor arranged between a photodetector 104 and a floatingdiffusion region 106. The second gate structure 402 is associated with areset transistor arranged between the floating diffusion region 106 anda source/drain region 404. Conductive contacts 114 are configured toconnect the first gate structure 108 and the second gate structure 402to one or more metal interconnect layers 406 arranged within adielectric structure 116 comprising one or more stacked inter-leveldielectric (ILD) layers disposed over the substrate 102.

A grid structure 408 is disposed over the dielectric structure 116. Thegrid structure 408 comprises sidewalls that define openings 409, whichoverlie pixel regions (e.g., pixel region 401) of the substrate 102. Invarious embodiments, the grid structure 408 may comprise a metal (e.g.,aluminum, cobalt, copper, silver, gold, tungsten, etc.) and/or adielectric material (e.g., SiO₂, SiN, etc.). A plurality of colorfilters 410 a-410 b are arranged within the openings 409 in the gridstructure 408. The plurality of color filters 410 a-410 b arerespectively configured to transmit specific wavelengths of incidentradiation. For example, a first color filter 410 a of the plurality ofcolor filters 410 a-410 b may transmit radiation having wavelengthswithin a first range (e.g., corresponding to green light), while asecond color filter 410 b of the plurality of color filters 410 a-410 bmay transmit radiation having wavelengths within a second range (e.g.,corresponding to red light) different than the first range, etc. Aplurality of micro-lenses 412 are arranged over the plurality of colorfilters 410 a-410 b. Respective ones of the plurality of micro-lenses412 are laterally aligned with the plurality of color filters 410 a-410b. The plurality of micro-lenses 412 are configured to focus theincident radiation (e.g., light) towards the underlying pixel regions(e.g., pixel region 401).

FIG. 4B illustrates a top-view 414 of some embodiments of the integratedimage sensor 400 of FIG. 4A. FIG. 4A illustrates the integrated imagesensor 400 along cross-sectional line A-A′ in top-view 414. It will beappreciated that top-view 414 shows selected components of theintegrated image sensor 400 while excluding other components to clarifythe figure. Furthermore, although top-view 414 illustrates a singlepixel region 401, it will be appreciated that the pixel region 401 maybe part of an array of pixel regions.

As shown in top-view 414, the trench 120 extends around the pixel region401 as a continuous structure. The doped epitaxial material 126 extendsfrom over the first photodiode region 202 to within the trench 120 alonga first direction 416 and along a second direction 418. The pixel region401 comprises the first gate structure 108 associated with the transfertransistor, the second gate structure 402 associated with the resettransistor, a source-follower transistor 214, and a row selecttransistor 216.

FIG. 5 illustrates a cross-sectional view of some additional alternativeembodiments of an integrated image sensor 500 having one or moredielectric materials and a doped epitaxial material arranged within atrench in a substrate.

As shown in cross-sectional view 500, the integrated image sensor 500comprises a photodiode 104 disposed within a pixel region 401. Thesubstrate 102 comprises interior surfaces (e.g., sidewalls and a lowersurface) defining trenches 120 disposed within a front-side 502 fsurface of the substrate 102 along opposing sides of the pixel region401. One or more dielectric materials 122 are disposed within the trench120. A doped material 126 having the second doping type (e.g., a p-typedoping) is also disposed within the trench 120. The doped material 126is arranged along opposing sidewalls, 120 a and 120 b, of the substrate102 that define the trenches, so that the doped material laterallyseparates the one or more dielectric materials 122 from both a firstsidewall 120 a of the substrate 102 and a second sidewall 120 b of thesubstrate 102.

In some embodiments, the integrated image sensor 500 may comprise aback-side illuminated (BSI) sensor. In such embodiments, a gridstructure 408 is disposed along a back-side 502 b of the substrate 102.A plurality of color filters 410 a-410 b are arranged within openings inthe grid structure 408, and a plurality of micro-lenses 412 areseparated from the substrate 102 by the plurality of color filters 410a-410 b.

FIGS. 6-15 illustrate cross-sectional views 600-1500 of some embodimentsof a method of forming an integrated image sensor having one or moredielectric materials and a doped epitaxial material arranged within atrench in a substrate. Although the cross-sectional views 600-1500 shownin FIGS. 6-15 are described with reference to a method, it will beappreciated that the structures shown in FIGS. 6-15 are not limited tothe method but rather may stand alone separate of the method.

As shown in cross-sectional view 600 of FIG. 6, a first well region 124a and a second well region 124 b having a second doping type (e.g., ap-type doping) are formed within a substrate 102 having a first dopingtype (e.g., an n-type doping). In various embodiments, the substrate 102may be any type of semiconductor body (e.g., silicon, SiGe, SOI, etc.),as well as any other type of semiconductor, epitaxial, dielectric,and/or metal layers, associated therewith. In some embodiments, thefirst well region 124 a and a second well region 124 b may be formed byselectively implanting a dopant species 602 into the substrate 102. Insome embodiments, the dopant species 602 may be selectively implantedinto the substrate 102 according to a first masking layer 604. Invarious embodiments, the dopant species may comprise a p-type dopant(e.g., boron, gallium, etc.) or an n-type dopant (e.g., phosphorus,arsenic, etc.). In some embodiments, after implanting the dopant speciesinto the substrate 102, a drive-in anneal may be performed to diffusethe dopant species within the substrate 102. In some embodiments, thefirst well region 124 a and the second well region 12 b may extend todepths within the substrate 102 that are substantially equal.

As shown in cross-sectional view 700 of FIG. 7, the substrate 102 isselectively etched to form a trench 120 defined by interior surfaces ofthe substrate 102 within the first well region 124 a. In someembodiments, the substrate 102 may be selectively etched by forming asecond masking layer 702 over the substrate 102, and subsequentlyexposing the substrate 102 to a first etchant 704 configured to form theone or more trench 120 by selectively removing unmasked parts of thesubstrate 102). In various embodiments, the first etchant 704 maycomprise a dry etchant having an etching chemistry comprising a fluorinespecies (e.g., CF₄, CHF₃, C₄F₈, etc.) or a wet etchant comprisinghydroflouric acid (HF), potassium hydroxide (KOH), or the like. In someembodiments, the second masking layer 702 may be formed over a pad oxidelayer arranged along an upper surface of the substrate 102.

As shown in cross-sectional view 800 of FIG. 8, one or more dielectricmaterials 122 are formed within the trench 120. In some embodiments, theone or more dielectric materials 122 may comprise an oxide (e.g.,silicon oxide), a nitride, a carbide, or the like.

In some embodiments, the one or more dielectric materials 122 may beformed by way of a deposition process (e.g., physical vapor deposition(PVD), chemical vapor deposition (CVD), PE-CVD, atomic layer deposition(ALD), sputtering, etc.). In some embodiments, the one or moredielectric materials may be formed by performing a thermal oxidationprocess with the second masking layer 702 in place over the substrate102, followed by a deposition process to fill the trench 120 with theone or more dielectric materials 122. After filling the trench 120 withthe one or more dielectric materials 122, a planarization process (e.g.,a chemical mechanical planarization process) may be performed to removethe second masking layer 702 and excess of the one or more dielectricmaterials 122 over the substrate 102.

As shown in cross-sectional view 900 of FIG. 9, a gate structure 108 isformed over the substrate 102. The gate structure 108 comprises aconductive gate material 112 separated from the substrate 102 by a gatedielectric layer 110. In some embodiments, the gate structure 108 may beformed by forming a dielectric layer onto the substrate 102, andsubsequently forming a conductive material over the dielectric layer.The dielectric layer and the conductive material are subsequentlypatterned according to a photolithography process to form the gatestructure 108.

As shown in cross-sectional view 1000 of FIG. 10, a first photodioderegion 202 and a floating diffusion region 106 are formed within thesubstrate 102. The first photodiode region 202 is formed within thesubstrate 102 at a position separated from the trench 120 by the firstwell region 124 a. In some embodiments, the first photodiode region 202may contact the first well region 124 a. The first photodiode region 202is formed within the second well region 124 b. In some embodiments, thefirst photodiode region 202 may have the first doping type that is thesame as the doping type of the substrate 102, but at a higher dopingconcentration than that of the substrate 102. In some embodiments, thefloating diffusion region 106 may have the first doping type, but at ahigher doping concentration than that of the first photodiode region202.

In some embodiments, the first photodiode region 202 and the floatingdiffusion region 106 may be formed by selectively implanting thesubstrate 102 with dopant species (e.g., boron) according to one or morepatterned masking layers (not shown) comprising photoresist. In someembodiments, the first photodiode region 202 is formed using a firstimplantation process at an energy in a range from about 35 KeV to about200 KeV, and at a dose in a range from about from about 5×10¹⁴ atoms/cm³to about 1×10¹⁸ atoms/cm³. In some embodiments, the floating diffusionregion 106 is formed using a second implantation process having a higherdose than that of the first implantation process.

As shown in cross-sectional view 1100 of FIG. 11, a dielectricprotection layer 206 is formed over the substrate 102 and alongsidewalls of the gate structure 108. In various embodiments, thedielectric protection layer 206 may comprise an oxide, a nitride, acarbide, or the like. The dielectric protection layer 206 may have athickness in a range about 1 nm to about 100 nm. In various embodiments,the dielectric protection layer 206 may be formed by using a rapidoxidation process, a low pressure chemical vapor deposition (LPCVD)process, or a plasma enhanced chemical vapor deposition (PECVD) process.

In some embodiments, sidewall spacers 118 are formed over the dielectricprotection layer 206. The sidewall spacers 118 may be formed bydepositing a spacer layer over the substrate 102 and the gate structure108. In some embodiments, the spacer layer may be deposited by adeposition technique (e.g., PVD, CVD, PE-CVD, ALD, sputtering, etc.) toa thickness in a range of between approximately 400 angstroms andapproximately 600 angstroms. The spacer layer is subsequently etched toremove the spacer layer from horizontal surfaces, leaving the spacerlayer along opposing sides of gate structure 108, as the sidewallspacers 118. In various embodiments, the spacer layer may comprisesilicon nitride, a silicon dioxide (SiO₂), silicon oxy-nitride (e.g.,SiON), or the like.

As shown in cross-sectional view 1200 of FIG. 12, a third masking layer1202 is formed over the substrate 102. The third masking layer 1202defines an opening 1204 overlying the trench 120 and the firstphotodiode region 202. In some embodiments, the third masking layer 1202may comprise a photoresist layer formed by a spin coating process.

As shown in cross-sectional view 1300 of FIG. 13, an etching process isperformed according to the third masking layer 1202. The etching processremoves a part of the dielectric protection layer 206 from over thesubstrate 102 and also removes a part of the one or more dielectricmaterials 122 from within the trench 120. In some embodiments, theetching process may use a second etchant 1302 comprising a wet etchant,such as hydrofluoric acid (HF), Tetramethylammonium hydroxide (TMAH),potassium hydroxide (KOH), or the like. In other embodiments, the secondetchant 1302 may comprise a dry etchant.

As shown in cross-sectional view 1400 of FIG. 14, a doped epitaxialmaterial 126 is formed within the trench 120. The doped epitaxialmaterial 126 may comprise a doped semiconductor material, such assilicon (e.g., monocrystalline silicon or polysilicon), silicongermanium, indium, or the like. The doped epitaxial material 126 has thesecond doping type (e.g., the p-type doping) with a higher dopingconcentration than that of the first well region 124 a or the secondwell region 124 b. In some embodiments, the doped epitaxial material 126may have a doping concentration that is in a range from about 5×10¹⁵atoms/cm³ to about 1×10¹⁹ atoms/cm³. Because the doping concentration ofthe doped epitaxial material 126 is higher than that of the first wellregion 124 a, dopants from the doped epitaxial material 126 may diffuseinto the first well region 124 a to give the first well region 124 a ahigher doping concentration than the second well region 124 b. In someembodiments, the diffusion of dopants from the doped epitaxial material126 to the first well region 124 a may give the first well region 124 aa gradient doping concentration that increases from a firstconcentration near the first photodiode region 202 to a larger, seconddoping concentration near the trench.

In some embodiments, the doped epitaxial material 126 may also be formedover the first photodiode region 202, so that the doped epitaxialmaterial 126 has a first region over the first photodiode region 202 anda second region within the trench 120. In such embodiments, the firstregion is configured to act as part of a photodetector 104 and thesecond region is configured to increase a doping concentration of thefirst well region 124 a near the trench 120 (e.g., by diffusion ofdopants from the doped epitaxial material 126 to the first well region124 a).

In some embodiments, the doped epitaxial material 126 may be formedusing a selective epitaxial growth and an in-situ doping process. Theselective epitaxial growth process grows the doped epitaxial material126 over the substrate 102 at locations not covered by the dielectricprotection layer 206.

As shown in cross-sectional view 1500 of FIG. 15, a conductive contact114 is formed within a dielectric structure 116 (e.g., an ILD layer)over the substrate 102. The conductive contact 114 extends through thedielectric structure 116 to contact the conductive gate material 112. Insome embodiments, the conductive contact 114 may be formed by way of adamascene process. In such embodiments, the dielectric structure 116 isformed over the substrate 102. The dielectric structure 116 issubsequently etched to form a contact hole, which is filled with aconductive material (e.g., tungsten, copper, and/or aluminum). Achemical mechanical planarization (CMP) process is subsequentlyperformed to remove excess of the conductive material from over thedielectric structure 116.

FIG. 16 illustrates a flow diagram of some embodiments of a method 1600of forming an integrated image sensor having one or more dielectricmaterials and a doped epitaxial material arranged within a trench in asubstrate.

While method 1600 is illustrated and described herein as a series ofacts or events, it will be appreciated that the illustrated ordering ofsuch acts or events are not to be interpreted in a limiting sense. Forexample, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects or embodiments of the description herein.Further, one or more of the acts depicted herein may be carried out inone or more separate acts and/or phases.

At 1602, first and second well regions having a second doping type areformed within a substrate having a first doping type. FIG. 6 illustratesa cross-sectional view 600 of some embodiments corresponding to act1602.

At 1604, the substrate is selectively etched to form a trench within thefirst well region. FIG. 7 illustrates a cross-sectional view 700 of someembodiments corresponding to act 1604.

At 1606, one or more dielectric materials are formed within the trench.FIG. 8 illustrates a cross-sectional view 800 of some embodimentscorresponding to act 1606.

At 1608, a gate structure is formed over the substrate. FIG. 9illustrates a cross-sectional view 900 of some embodiments correspondingto act 1608.

At 1610, a first photodiode region having the first doping type isformed within the substrate adjacent to the first well region. FIG. 10illustrates a cross-sectional view 1000 of some embodimentscorresponding to act 1610.

At 1612, a floating diffusion region having the first doping type isformed within the second well region. FIG. 10 illustrates across-sectional view 1000 of some embodiments corresponding to act 1612.

At 1614, a dielectric protection layer is formed over the substrate andalong opposing sides of the gate structure. FIG. 11 illustrates across-sectional view 1100 of some embodiments corresponding to act 1614.

At 1616, sidewall spacers are formed over the dielectric protectionlayer and along opposing sides of the gate structure. FIG. 11illustrates a cross-sectional view 1100 of some embodimentscorresponding to act 1616.

At 1618, a part of the one or more dielectric materials within thetrench is removed. FIGS. 12-13 illustrate cross-sectional views1200-1300 of some embodiments corresponding to act 1618.

At 1620, a part of the dielectric protection layer directly over thefirst photodiode region is removed. FIGS. 12-13 illustratecross-sectional views 1200-1300 of some embodiments corresponding to act1620.

At 1622, a doped epitaxial material having the second doping type isformed within the trench and over the first photodiode region. The dopedepitaxial material may comprise a second photodiode region contacting anupper surface of the first photodiode region. FIG. 14 illustrates across-sectional view 1400 of some embodiments corresponding to act 1622.

At 1624, a conductive contact is formed within a dielectric structureover the substrate FIG. 15 illustrates a cross-sectional view 1500 ofsome embodiments corresponding to act 1624.

Accordingly, in some embodiments, the present disclosure relates to anintegrated image sensor having an isolation trench comprising one ormore dielectric materials and a doped epitaxial material configured toreduce leakage current between adjacent pixel regions.

In some embodiments, the present disclosure relates to an integratedchip. The integrated chip includes a photodetector arranged within asemiconductor substrate having a first doping type; one or moredielectric materials disposed within a trench defined by interiorsurfaces of the semiconductor substrate; and a doped epitaxial materialarranged within the trench at a location laterally between the one ormore dielectric materials and the photodetector, the doped epitaxialmaterial has a second doping type that is different than the firstdoping type. In some embodiments, the integrated chip further includes afirst well region disposed within the semiconductor substrate betweenthe trench and the photodetector, the first well region has the seconddoping type and a smaller doping concentration than that of the dopedepitaxial material. In some embodiments, the integrated chip furtherincludes a floating diffusion region disposed within the semiconductorsubstrate; a gate structure disposed over the semiconductor substratebetween the photodetector and the floating diffusion region; and asecond well region disposed within the semiconductor substrate andsurrounding the floating diffusion region, the second well region hasthe second doping type and a smaller doping concentration than that ofthe first well region between the trench and the photodetector. In someembodiments, the doped epitaxial material separates the one or moredielectric materials from a first sidewall of the semiconductorsubstrate defining the trench; and the one or more dielectric materialsseparate the doped epitaxial material from a second sidewall of thesemiconductor substrate defining the trench. In some embodiments, thedoped epitaxial material directly contacts the first sidewall. In someembodiments, the photodetector includes a first photodiode regiondisposed within the substrate and having the first doping type; and thedoped epitaxial material continuously extends from within the trench todirectly above the first photodiode region, the doped epitaxial materialdirectly above the first photodiode region defining a second photodioderegion. In some embodiments, the doped epitaxial material directlycontacts an upper surface of the first photodiode region. In someembodiments, the doped epitaxial material protrudes outward from withinthe trench to over the semiconductor substrate. In some embodiments, theintegrated chip further includes a dielectric protection layer arrangedover the one or more dielectric materials within the trench, thedielectric protection layer laterally contacts a sidewall of the dopedepitaxial material.

In other embodiments, the present disclosure relates to an integratedchip. The integrated chip includes a substrate having interior surfacesdefining a trench; a first well region disposed within the substratebetween the trench and a first photodiode region; a floating diffusionregion surrounded by a second well region disposed within the substrate;a gate structure arranged over the substrate between the firstphotodiode region and the floating diffusion region; one or moredielectric materials disposed within the trench; and a doped epitaxialmaterial arranged within the trench between the one or more dielectricmaterials and the first well region. In some embodiments, the dopedepitaxial material separates the one or more dielectric materials from afirst sidewall of the substrate defining the trench; and the one or moredielectric materials separate the doped epitaxial material from a secondsidewall of the substrate defining the trench. In some embodiments, thedoped epitaxial material continuously extends from within the trench todirectly contact a top of the first photodiode region. In someembodiments, the doped epitaxial material has a larger dopingconcentration that of the first well region or the second well region.In some embodiments, the integrated chip further includes sidewallspacers arranged along opposing sides of the gate structure, the dopedepitaxial material laterally contacts the sidewall spacers. In someembodiments, the substrate has a first doping type, the first wellregion and the second well region have a second doping type differentthan the first doping type, the first photodiode region has the firstdoping type, and the doped epitaxial material has the second dopingtype.

In yet other embodiments, the present disclosure relates to a method offorming an integrated chip. The method includes doping a substrate toform a first well region and a second well region having a first dopingtype, the first well region and the second well region have a seconddoping type; selectively patterning the substrate to define a trenchextending into the first well region; filling the trench with one ormore dielectric materials; doping a first photodiode region within thesubstrate, the first photodiode region is separated from the trench bythe first well region; removing a part of the one or more dielectricmaterials from within the trench; and growing a doped epitaxial materialalong a sidewall of the trench that is proximate to the first photodioderegion. In some embodiments, the method further includes forming adielectric protection layer over the one or more dielectric materialswithin the trench; and forming the doped epitaxial material using aselective epitaxial growth process that forms the doped epitaxialmaterial on surfaces not covered by the dielectric protection layer. Insome embodiments, the method further includes forming a gate structureover the substrate at a location adjacent to the first photodioderegion; and forming sidewall spacers along opposing sides of the gatestructure, the dielectric protection layer extends between the substrateand the sidewall spacers. In some embodiments, the doped epitaxialmaterial has a larger doping concentration than that of the first wellregion and the second well region. In some embodiments, the methodfurther includes forming a floating diffusion region within the secondwell region; and forming a gate structure over the substrate between thefloating diffusion region and the first photodiode region.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated chip, comprising: a photodetectorregion arranged; to at least partly include an upper surface of asemiconductor substrate; one or more dielectric materials disposedwithin a trench defined by one or more interior surfaces of the;semiconductor substrate, the trench extends from the upper surface ofthe semiconductor substrate to within the semiconductor substrate; adoped epitaxial material arranged within the trench and between the oneor more dielectric materials and the photodetector region; and adielectric protection layer arranged directly over an upper surface ofthe one or more dielectric materials within the trench, wherein thedielectric protection layer contacts a sidewall of the doped epitaxialmaterial.
 2. The integrated chip of claim 1, further comprising: a wellregion disposed within the semiconductor substrate between the dopedepitaxial material and the photodetector region.
 3. The integrated chipof claim 2, wherein the sidewall of the doped epitaxial materialcontacts both a sidewall of the dielectric protection layer and asidewall of the one or more dielectric materials.
 4. The integrated chipof claim 1, wherein the doped epitaxial material that is within thetrench has a first width that is less than a second width of the trench.5. The integrated chip of claim 1, wherein a side of the doped epitaxialmaterial that faces the one or more dielectric materials also extends tovertically above a top of the one or more dielectric materials.
 6. Theintegrated chip of claim 1, wherein the doped epitaxial material has anoutermost sidewall that is separated by non-zero distances from opposingsidewalls of the semiconductor substrate that define the trench.
 7. Anintegrated chip, comprising: an image sensing element arranged within asubstrate, the substrate having a first sidewall and a second sidewallthat define a trench within the substrate in a cross-sectional view; oneor more dielectric materials arranged within the trench and contactingthe first sidewall; and a doped epitaxial material arranged within thetrench and contacting the second sidewall.
 8. The integrated chip ofclaim 7, further comprising: a gate structure disposed over thesubstrate; and sidewall spacers arranged along opposing sides of thegate structure, wherein the doped epitaxial material laterally contactsthe sidewall spacers.
 9. The integrated chip of claim 7, furthercomprising: a well region disposed within the substrate and laterallycontacting the doped epitaxial material.
 10. The integrated chip ofclaim 7, wherein the doped epitaxial material is also arranged directlyover the image sensing element.
 11. The integrated chip of claim 7,wherein the second sidewall is closer to the image sensing element thanthe first sidewall.
 12. The integrated chip of claim 7, wherein thedoped epitaxial material is over a horizontally extending surface of theone or more dielectric materials.
 13. An integrated chip, comprising: aphotodetector region arranged; to at least partly include an uppersurface of a substrate; one or more dielectric materials disposed withina trench defined by one or more interior surfaces of the substrate, thetrench having a height that extends from the upper surface of thesubstrate to within the substrate; and a doped epitaxial materialdisposed within the trench and having an outermost sidewall facing awayfrom the doped epitaxial material, the outermost sidewall contacting asidewall of the one or more dielectric materials along an interfaceextending along the height of the trench.
 14. The integrated chip ofclaim 13, wherein the one or more dielectric materials contact thesubstrate.
 15. The integrated chip of claim 13, wherein the dopedepitaxial material continuously extends from within the trench tooutside of the trench.
 16. The integrated chip of claim 13, wherein thedoped epitaxial material directly contacts an upper surface of thephotodetector region.
 17. The integrated chip of claim 13, furthercomprising: a dielectric protection layer arranged over the one or moredielectric materials within the trench, wherein the doped epitaxialmaterial extends from vertically below the dielectric protection layerto vertically above the dielectric protection layer.
 18. The integratedchip of claim 13, wherein the one or more dielectric materials contact ahorizontally extending surface of the substrate defining the trench. 19.The integrated chip of claim 13, wherein a horizontally extendingsurface of the substrate defining the trench extends in opposingdirections for non-zero distances past the outermost sidewall of thedoped epitaxial material.
 20. The integrated chip of claim 13, whereinthe doped epitaxial material within the trench has a first width and thetrench has a second width that is greater than the first width.